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High Hardness Large Synthetic Diamond For Precision Machining In Automobile
The main features:
Diamond single wafer has high hardness, good wear resistance, impact toughness, good thermal conductivity, high finish, and non-ferrous metal friction coefficient is low, good adhesion resistance and excellent thermal stability and chemical stability, can grind extremely sharp edge, is the most ideal ultra-precision cutting tool material.As the tool material, its performance is far more than carbide, Diamond composite sheet and other cutting tool material, with natural diamond cutting tool material comparable to the new era of cutting tool material.
Application areas:
Diamond single wafer is the ideal material for precision machining in automobile, machine tool, bearing, tool, hydraulic and other industries; also used in aerospace, optical materials, jewelry processing, watches, instruments, instrument manufacturing, fiber optic cable infrared and other high-tech fields.